Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over ...

Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by ...

Third-party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.

The dream may be to have generative AI write RTL, but text is only one of the necessary things AI must understand to help ...

Pooling CPU Memory for LLM Inference” was published by researchers at UC Berkeley. Abstract “The rapid growth of LLMs has ...

Any optimization problem must have a clear, unambiguous specification and a way to define the goodness of the solution. Today ...

LLMs and machine learning are automating expertise in an aging workforce.

Despite its cost and complexity, HBM offers significant advantages when performance and bandwidth are critical.

Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions” was ...

The Synopsys Custom Design flow provides unique benefits for power electronics designers, and the close collaboration with ...

A technical paper titled “Detection of defective chips from nanostructures with a high-aspect ratio using hyperspectral ...

The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled ...